Has sufficient strength to ensure wafer, a corresponding increase in the thickness of the wafer

As wafer diameter increases, in order to ensure sufficient strength of silicon, a corresponding increase in the thickness of the wafer; the contrary, in order to meet the needs of advanced IC chip packaging technology, thinner thickness of the chip. These changes make the wafer planarization process faces many outstanding technical issues: IC  polycrystalline diamond , for wafer processing accuracy and surface quality high demands; wafer diameter increases, the process is easy to warpage, machined surface type easy to ensure accuracy; silicon thickness increases and chip  Diamond blade , so that the back of wafer thinning process increases the amount of material removal, improve processing efficiency become a serious problem. Therefore, the use of ultra-precision consolidation abrasive grinding technology is replacing  Polycrystalline diamond  silicon ultra-precision grinding technology become planarization processing technologies mainstream of development, one of the most representative of the silicon self-rotating grinding method is considered to be large planarized wafer size ideal for processing grinding method.