Due to the PDC is prepared from at high temperature, diamond and cemented carbide substrate and the thermal expansion coefficient

Due to the PDC is  abrasive grinding  at high temperature, diamond and cemented carbide substrate and the thermal expansion coefficient, elastic modulus and other physical properties vary greatly, so that inevitably there is a lot at the interface of the residual stress Sichuan, if not handled properly will cause the PDC products placed  Polycrystalline diamond  after a period of time from the interface crack: Even more serious is the underground work, individual PDC cracking due to stress caused by the failure of the downhole drill brought huge economic losses. At present, reported in the literature to see from the PDC interface stress little research, PDC stress characterization and testing methods virtually no coverage. PDC attempts to analyze the stress resulting from the type of situation exists start exploring PDC interface stress characterization methods.