Because of its typical of brittle materials, ultra-precision machining very difficult

Sapphire crystal has good thermal properties, wear resistance, electrical properties and dielectric characteristics, and its Mohs hardness of 9, still has good high temperature stability, it is widely used in industrial, defense, scientific research other fields. In addition, the sapphire single crystal manufacturing of optoelectronic devices is an important substrate materials. With optoelectronic devices to  polycrystalline diamond  improve product performance, single crystal sapphire substrate machining accuracy and surface quality requirements higher and higher, but because it belongs to a typical brittle materials,  synthetic diamond  machining very difficult. Present research on the single-crystal sapphire substrate ultra-precision  grinding wheel  technology research reported rarely. In this paper, single-crystal sapphire substrate chemical mechanical polishing process and the consolidation of soft abrasive grinding and polishing mechanism of the system's Test. The main task for the sapphire substrate includes a mechanical problem in polishing using a chemical mechanical polishing process scheme.